Invited Speakers |
|
Hakan Altan | Middle East Technical University, TURKEY |
Antonello Andreone | Università degli Studi di Napoli Federico II, ITALY |
Teresa de los Arcos | Ruhr University, GERMANY |
Petre Badica | National Institute of Materials Physics, ROMANIA |
Jas Pal Badyal | Durham University, UK |
Deepak Kumar Basa | Utkal Univ., INDIA |
Jens Birch | Linköping University, SWEDEN |
Alpan Bek | Middle East Technical University, TURKEY |
Ian W. Boyd | Brunel University, UK |
Jian Chen | Nanjing University, CHINA |
Li-Chyong Chen | National Taiwan University, TAIWAN |
Satoshi Demura | Tokyo University of Science, JAPAN |
Hasan Efeoglu | Ataturk University, TURKEY |
Kazuhiro Endo | Kanazawa Institute of Technology, Kanazawa, JAPAN |
Mehdi Fardmanesh | Sharif University of Technology, IRAN |
Aseel Kadhim Hassan | Sheffield Hallam University, UK |
David Haviland | Royal Institute of Technology, SWEDEN |
Ray-Hua Horng | National Chung-Hsing University, TAIWAN |
Maria Iavarone | Temple University, USA |
Kazuo Kadowaki | University of Tsukuba, JAPAN |
Goran Karapetrov | Drexel University, USA |
Hironori Katagiri | Nagaoka National College of Technology, JAPAN |
Chee-Wee Liu | National Taiwan University, TAIWAN |
Daniel Lundin | Royal Institute of Technology, SWEDEN |
Kaname Matsumoto | Kyushu Institute of Technology, JAPAN |
Mohamed Missous | University of Manchaster, UK |
Stanislav Mraz | Aachen University, GERMANY |
Kensuke Nakajima | Yamagata University, JAPAN |
Lars Pleth Nielsen | Danish Technological Institute, DENMARK |
Peter H.L. Notten | Eindhoven University of Technology, NETHERLANDS |
Sener Oktik | Žižecam, TURKEY |
Shigetoshi Ohshima | Yamagata Univ., JAPAN |
Mauro Pereira | Sheffield Hallam University, Sheffield, UK |
Lothar Pfitzner | Fraunhofer Institute for Integrated Systems and Device Technology., GERMANY |
John L. Reno | Sandia National Laboratories, USA |
Hidemi Shigekawa | University of Tsukuba, JAPAN |
Sefik Suzer | Bilkent Univ., TURKEY |
Yoshihiko Takano | NIMS, JAPAN |
Dong-Sing Wuu | National Chung-Hsing University, TAIWAN |
John F. Zasadzinski | Illinois Institute of Technology, USA |